Research areas
- Physical Sciences
Contact
Phone: (+34) 943 212800
Available for external users?
Yes
Description
FEI QUANTA3DFEG DualBeam system. It features a high-resolution scanning electron microscope (~1 nm) and a gallium ion gun that enables the deposition and ablation of material. In addition, image analysis software has been developed which enables the determination of residual stresses from FEGSEM images across a range of scales from 1 µm to 800 µm and at depths of approximately 0.5–50 µm.
Equipment
- DualBeam QUANTA3DFEG
- MATLAB-based DIC software
Services
- Measurement of residual stress profiles in welds
- Measurement of the distribution of residual stresses across a ground surface
- Measurement of stress profiles at various depths within ground surfaces
Location
CEIT
Miramon Building, Parque Tecnológico de San Sebastián, Paseo Mikeletegi, Nº 48, 20009, Donostia - San Sebastián, SPAIN
Other info
Characterisation and inspection:
- Metrology and inspection technologies
- Advanced manufacturing technologies
Application sectors
- Aerospace
- Automotive
- Capital goods
- Energy
- Foundry and steelmaking
- Metallurgy
- Steelmaking and foundry
Industry Plan
- HAZI · Aerospace
- IRABAZI · Automotive components
- IRABAZI · Energy
- IRABAZI · Advanced manufacturing
- IRABAZI · Metallurgy
